Inkampani yeNingbo Deamakyinkampani egxile ekwakhiweni nasekukhiqizeni izibani zasebusuku ezihlakaniphile.Ubuchwepheshe bomthombo wokukhanya we-COB busetshenziswa kweminye imikhiqizo yenkampani.
Umthombo wokukhanya we-COB ungumthombo wokukhanya ohlangene wamandla aphezulu.Iwubuchwepheshe bomthombo wokukhanya okhanyayo osebenza kahle kakhulu obunamathisela ngokuqondile I-chip ye-LED esibukweni sensimbi esingaphansi esinezinga eliphezulu lokucwebezela.Lobu buchwepheshe buqeda umqondo wokubakaki futhi alunayo i-electroplating, i-reflow welding kanye nenqubo ye-SMT, ngakho inqubo incishiswa cishe ngengxenye eyodwa kwezintathu futhi izindleko nazo zilondolozwa ngengxenye eyodwa kwezintathu.
Umthombo wokukhanya we-COB ungaklanywa ngokuya ngesakhiwo somumo womkhiqizo wendawo yokukhanya yomthombo wokukhanya nosayizi.
Izici zomkhiqizo: ezishibhile, ezikahle
Ukuzinza kukagesi, idizayini yesekethe, idizayini yokubona, idizayini yokushabalalisa ukushisa ngokwesayensi futhi inengqondo;
Ubuchwepheshe bokucwiliswa kokushisa kwamukelwa ukuze kuqinisekiswe ukuthi i-LED inezinga elihamba phambili lemboni yokugcinwa kwelume elishisayo (95%).
Ilungele ukufanisa okwesibili kwe-optical yomkhiqizo futhi ithuthukisa ikhwalithi yokukhanyisa.
Isibonisi sombala ophezulu, i-luminescence efanayo, akukho ndawo yokukhanya, ezempilo kanye nokuvikelwa kwemvelo.
Ukufakwa okulula, kulula ukuyisebenzisa, kunciphisa ubunzima bokuklama isibani, ukulondoloza ukucubungula kwesibani kanye nezindleko zokulungisa ezilandelayo.
Kunezindlela ezimbili eziyinhloko zobuchwepheshe be-Chip ezingenalutho: ubuchwepheshe be-COB kanye nobuchwepheshe be-Flip Chip.I-Chip on board packaging (COB), i-semiconductor chip handover enamathiselwe ebhodini lesifunda PRINTED, uxhumano lukagesi lwe-chip kanye ne-substrate lwenziwa ngendlela ye-lead suture, futhi lumbozwe nge-resin ukuze kuqinisekiswe ukwethembeka.
Inqubo ye-Chip On Board (COB) iwukumboza indawo yokubeka i-silicon wafer nge-thermal conductive epoxy resin (ngokuvamile isiliva doped epoxy resin) Ngaphezulu kwe-substrate, bese ubeka isicwecwana se-silicon ngqo Phezu kwe-substrate, ukushisa ukushisa kuze kube yilapho isicwecwana se-silicon sigxilile ku-substrate.Khona-ke i-wire welding isetshenziselwa ukusungula uxhumano oluqondile lukagesi phakathi kwe-silicon wafer kanye ne-substrate.
Uma ufuna ukwazi okwengeziwe ngemikhiqizo yethu, sicela uvakashele iwebhusayithi yethu esemthethweni:www.deamak.com
Isikhathi sokuthumela: May-04-2022